Factory location: Xia Mei Lin, Futian Area, Shenzhen, China
(20 minutes drive from Shenzhen Railway Station)
(2 hours drive from Hong Kong headquarters)
Floor Area: 500,000 square feet
Plant Capacity: 8,000,000 units per annum
Investment in Manufacturing Equipment: approximately US$ 35 million
Major Machines:
  • Jet-Wave Soldering Machines
  • In-circuit Testers
  • Automatic Stopper Lines with Material Transfer Systems
  • Dual Head Jumper Wire Inserters
  • Axial Type Insertion Machines
  • Radial Type Insertion Machines
  • Solder Paste Printing Machines
  • High-Speed Adhesive Dispenser Machine
  • Multifunctional High-Speed SMD with Glue Dispenser, Chips Pick & Place Machines & Reflow Ovens
Future expansion: A new "Technology Building" situated next to the main factory is erected in December 1999 to accommodate the expansion of Engineering Department and R & D Center.